Thermal Silica gel is a high-end heat conductive compounds, and will not be solid, not conductive characteristics can avoid such as circuit short-circuit risk; its high bonding performance and super thermal conductivity are the best thermal conductivity solution for current CPU, GPU and radiator contacts.

Performance Benefits

1, the range of thermal conductivity and stability

2, the structure of the process tolerance of the bridge to reduce the radiator and heat dissipation components of the process tolerance requirements

3. EMC, Insulation performance

Thermal conductivity silica gel with high thermal conductivity, excellent thermal conductivity, good electrical properties, wide use of temperature, good use of stability, low consistency and good construction performance.