Add: NO.831 Gongchang Road, Lou Village Gongming Town Guangming Dist, Shenzhen,China

Contact: James

Tel: 0086-755-23196257

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Electrical Potting Compound As Encapsulation Material

Features 1 Low shrinkage, low optical absorbance, low refractive index 2 Easy to handle due to a one component liquid type. 3 Applied shape is well maintained.. 4 Very high capability of thermal resistance. 5 Very high capability of UV light resistance.

 Thermal Potting Compound

Product Number

DR55018

Test standard

Cured Method

Heat Cure

/

Before Curing

appearance

Gray

Visual

Viscosity

>55000

ASTM D4287

Fully curing condition

130℃ 30min

ASTM D2377

Physical Performance after curing

Thermal conductivity

2.0W W/m.K

ASTM D5470

Hardness Shore A

80-85

ASTM D2240

Tensile Strength

1.2 Mpa

ASTM D412

Elongation

≥40%

ASTM D412

Electrical Performance after curing

Volume Resistance

10×1012 Ω.CM

ASTM D257

Dielectric Strength

≥16 KV/m

ASTM D149

Dielectric Constant 60Hz

2.4

ASTM D150

The properties is based on 25℃ 55% humidity


Features

1 Low shrinkage, low optical absorbance, low refractive index 

2 Easy to handle due to a one component liquid type.

3 Applied shape is well maintained..

4 Very high capability of thermal resistance.

5 Very high capability of UV light resistance.

We're one of the professional China manufacturers and suppliers specialized in thermal interface material. If you're interested in our electrical potting compound as encapsulation material, welcome to place orders for the quality products in stock with our factory. The free sample is also available for quality checking if you need.

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