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Thermal Silicone Seal for Electronics Potting

Application 1 COB LED industry 2 Chip Package

 Thermal Potting Compound

Product Number

DR55019

Test standard

Cured Method

Heat Cure

/

Before Curing

appearance

Gray

Visual

Viscosity

>52000

ASTM D4287

Fully curing condition

150℃ 30min

ASTM D2377

Physical Performance after curing

Thermal conductivity

1.8W W/m.K

ASTM D5470

Hardness Shore A

70-80

ASTM D2240

Tensile Strength

1.2 Mpa

ASTM D412

Elongation

≥50%

ASTM D412

Electrical Performance after curing

Volume Resistance

10×1012 Ω.CM

ASTM D257

Dielectric Strength

≥16 KV/m

ASTM D149

Dielectric Constant 60Hz

2.4

ASTM D150

The properties is based on 25℃ 55% humidity


Application

1 COB LED industry 2 Chip Package

We're one of the professional China manufacturers and suppliers specialized in thermal interface material. If you're interested in our thermal silicone seal for electronics potting, welcome to place orders for the quality products in stock with our factory. The free sample is also available for quality checking if you need.

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